-40%
Sizzix Accessory - Multipurpose Platform, Standard
Sizzix Accessory - Multipurpose Platform, Standard

Sizzix Accessory - Multipurpose Platform, Standard

$ 15.83

Availability: 13 in stock
  • Ebay colour: White
  • Ebay theme: Scrapbooking
  • Return shipping will be paid by: Buyer
  • All returns accepted: Returns Accepted
  • Item must be returned within: 30 Days
  • Refund will be given as: Money Back
  • Restocking Fee: No
  • Brand: Sizzix
  • MPN: 655091
  • Condition: New
  • Type: Die Cutting & Embossing

    Description

    This sturdy platform with hinged tabs was specially designed for use in the Big Shot and BIGkick machines as well as in the Big Shot Express and Vagabond machines. The adjustable Multipurpose Platform easily makes all Sizzix components thinner than a Bigz Die compatible with the BIGkick, Big Shot and Vagabond machines.
    To die-cut or emboss one layer of thin material using thinner Sizzix products (Clearlits, DecoEtch, DecoEmboss, Embosslits, Ink-its, Sizzlits, Simple Impressions, Texture Fades, Texture Trades and Textured Impressions), the Multipurpose Platform (Platform base plus Tab 1) is required along with Cutting Pads. To emboss one layer of thin material using Texturz Texture Plates, the Multipurpose Platform (Platform base plus Tab 1) is required along with an Impressions Pad and Silicone Rubber.
    To emboss one layer of thick material (or a folded card) using thinner Sizzix products (Texture Fades, Texture Trades and Textured Impressions), the Multipurpose Platform (Platform base only, no tabs) is required along with Cutting Pads. To emboss one layer of thick material using Texturz Texture Plates, the Multipurpose Platform (Platform base only, no tabs) is required along with an Impressions Pad and Silicone Rubber. The diagrams on the Multipurpose Platform and its tabs offer easy guidelines about how to make the perfect Sizzix sandwich.
    Use of the platform base plus Tabs 1 and 2 of the Multipurpose Platform along with Cutting Pads are required to create a sandwich for accommodating Framelits and Thinlits as well as competitors' wafer-thin dies.